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- Polycrystalline Silicon Wafers are made by wire-sawing block-cast silicon ingots into thin slices. The front side of the polycrystalline silicon wafers is lightly p-type-doped. The backside is n-type-doped. In contrast, the front side is n-doped. These two types of semiconductors can be used in many electronic devices.
- A Semiconductor Wafer is a thin slice of semiconductor substance, like crystalline silicon, used in electronics for the making of integrated circuits. In the electronics jargon, a thin slice of semiconductor material is called as a wafer or a slice or substrate. It could be a crystalline silicon (C-Si), which is used in the making of integrated circuits, photovoltaics solar cells and other micro devices.
- The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning. Finally, the individual microcircuits are separated by wafer dicing and packaged as an integrated circuit.